When the demand for power density in industrial power supplies, energy storage equipment, new energy transportation and other fields breaks through the limit, traditional MOSFET packaging technology is facing unprecedented challenges. The TOLT top heat dissipation package MOS launched by Guangdong MOT has become the core solution for high-power scenarios with its disruptive heat dissipation design and power carrying capacity. This device, designed specifically for large chips and high currents, is redefining the application boundaries of power semiconductors with its three major advantages: "fast heat dissipation, low loss, and high density. "
Subverting the traditional top heat dissipation: making high power no longer "hot"
The core breakthrough of TOLT packaging is to completely reconstruct the traditional bottom heat dissipation path "Junction → PCB" into "Junction → top heat sink". This design is like opening a "heat dissipation skylight" for the chip:
· Thermal conduction efficiency soars: The heat is directly conducted to the heat sink through the top TIM thermal interface material, which reduces the temperature by 36% compared to the TOLL package and nearly doubles the heat dissipation efficiency of the traditional TO-220 plug-in package.
· Free power density: Allows the chip to operate in a higher temperature range. With large-size chip design, a single device can carry a continuous current of more than 50A, easily handling high-current scenarios such as charging piles and energy storage converters.
· PCB design liberation: getting rid of the dependence on PCB vias and copper foil for bottom heat dissipation, the driver circuit can be freely laid out on the back of the circuit board, increasing the power density by more than 40%.
Five technical features: “hard core support” for high-power scenarios
▶ Kelvin foot design: the “magic key” that drives efficiency improvement
The built-in independent Kelvin source pin reduces the parasitic inductance to less than 1nH, reduces switching loss by 20%, and the efficiency exceeds 99% in high-frequency inverter scenarios.
▶ 1mm creepage distance: “protective wall” for high voltage safety
Compared with the JEDEC standard, the creepage distance is increased by 1mm, and it can easily pass the 1500V withstand voltage test, meeting the safety requirements of high-voltage applications such as energy storage battery packs and industrial power supplies.
▶ Gull-wing pins: “Guardians” of process reliability
The unique gull-wing structure increases the patch welding area by 30% and increases the vibration resistance by 5 times. At the same time, the visual inspection of solder joints is convenient and there is no void rate problem, making it a perfect fit for automated production lines.
▶ Clip bonding technology: a “booster” for low resistance and high current
A copper clip is used internally to replace traditional gold wire bonding, which reduces RDS (ON) by 15% and reduces the temperature rise by another 12% under high current. It is especially suitable for BMS double-sided mounting scenarios and is 22% lower than TOLL packaging temperature.
▶ Ultra-thin design: the “promoter” of the space revolution
With a thickness of only 1. 2mm, it can be directly mounted on the equipment shell for heat dissipation. It replaces the traditional TO-220/247 plug-in, halving the product thickness and freeing up more space for compact equipment such as electric forklifts and unmanned boats.
Full scene coverage: the “power heart” from industry to new energy
In the industrial field, TOLT packaged MOS has become the standard for AI server power supplies and communication base station power supplies. Its high reliability helps data centers operate 24 hours a day. In new energy transportation scenarios, from two-wheeled electric vehicles to yacht motor controllers, it extends the cruising range by more than 15% with its low loss characteristics. In the field of battery BMS, the double-sided mounting solution increases the energy density of the battery pack by 20%, becoming the key to reducing costs and increasing efficiency of energy storage systems.
Today, MOT has achieved mass production of a full range of TOLT packages for medium and low voltage MOS, Cool MOS, and SiC MOS, providing one-stop services from design to mass production for high-end industrial and new energy markets. When high-power applications meet TOLT, a revolution in efficiency and space is taking place – your next high-power solution may only require this "breathing" MOSFET.
(If you need to know the actual measured data of TOLT packaging or apply for samples, please leave a private message to obtain the technical manual)
