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Designing the PCB Thermal Path for Power MOSFETs
Turn package loss into a realistic junction-temperature estimate by designing and validating copper spreading, vias, interfaces, and airflow together.
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Turn package loss into a realistic junction-temperature estimate by designing and validating copper spreading, vias, interfaces, and airflow together.
Turn package loss into a realistic junction-temperature estimate by designing and validating copper spreading, vias, interfaces, and airflow together.